Product specifications
TINKER BOARD 3N/4G/32G
90ME06K1-M0EAY0
Tinker Board 3N
Arm-based Single Board Computer (SBC) with enhanced computing performance, low power consumption and rich interfaces for industrial use. Achieving interoperability, scalability and reliability, ASUS IoT Tinker Board 3N single-board computers (SBCs) deliver Arm®-based power and versatility for embedded applications in NUC size.
- 64-bit, quad-core Arm Cortex-A55 processor, built on the Arm v8 architecture
- Dual LAN built in, and PoE PD supported via expansion module
- 4G, 5G, Wi-Fi 5 and Wi-Fi 6 supported via expansion module
- LVDS, eDP, COM and CANbus embedded and industrial interfaces supported
- Wide -40 to 85°C operating-temperature range
- Linux Debian, Yocto and Android operating systems supported
Top notch performance:
With its versatile and modern 64-bit, quad-core ARM-based processor — the Rockchip RK3568 — ASUS IoT Tinker Board 3N offers superior performance in NUC size. Powered by an ARM-based Mali™-G52 GPU, Tinker Board 3N offers smoother graphics processing and better data security, allowing for a wide range of applications in smart manufacturing and smart retail such as IoT gateways, human-machine interfacing (HMI), digital signage, self-service kiosk and more.
One of the key advantages of the Tinker Board 3N is its advanced memory configuration to better fulfill diversified market requirement. Featuring LPDDR4X memory, the board offers better data-transfer rates and operates with just 55% of the energy required by LPDDR4, while also boasting 5X-lower power consumption in standby mode compared to DDR4.
Optimized thermal design:
Tinker Board 3N features an advanced thermal design including a low-profile pushpin heatsink and SoC placement on the back side for added strength and ease of installation, with its diminutive NUC-scale dimensions allowing for SWaP-constrained space deployment and flexible system integration.. With reduced thermal throttling, developers can push the limits of performance without compromising stability. It is also engineered to operate smoothly in harsh industrial environments, with an impressive operating-temperature range of -40 to 85°C — making it ideal for everything from outdoor use to hectic factory environments.
Multiple displays supported:
With LVDS support and dual-channel Full HD output, Tinker Board 3N enables seamless integration into a wide range of display systems and thus saves much project deployment time and effort
Enhanced connectivity:
Tinker Board 3N offers versatile connectivity options, ensuring superior system expandability for a wide range of applications. With interfaces such as PoE, LVDS, COM and CAN bus, this versatile SBC provides ample opportunities for seamless integration into various industrial and automation systems. Whether it's factory controllers, robotic arms or alarm settings, Tinker Board 3N is ready for the task at hand.
Tinker Board 3N is also engineered with M.2 E and M.2 B slots, allowing for the addition of Wi-Fi or 4G/5G expansion modules. These expansion slots enable seamless integration of connectivity options, expanding the board's capabilities — and ensure seamless wireless and cloud connectivity, reducing latency for real-time applications in smart factories and other IoT environments. The embedded COM headers and CAN bus functionality further enhance the board's versatility, enabling it to meet the demands of diverse applications.
Specifications 3N:
SoC: Rockchip RK3568
CPU: Quad-core Arm® Cortex®-A55
GPU: Arm® Mali™-G52
Memory: Dual-CH LPDDR4/LPDDR4X On-Board - 2GB / 4GB / 8GB
Storage: none / 32GB / 64GB eMMC, 1x Micro SD(TF) card slot (push/pull)
SPI Flash: 16MB
Ethernet: 2 x Realtek RTL8211
POE PD: 1 x one LAN support POE via module card, 802.3at 25W (separate)
Wi-Fi / BT*: 1 x Wi-Fi 5 & BT 5.0 (2T2R), default occupied M.2 E key
M.2 E key: 1 x 2230 for Wi Fi 5/6 & BT (PCIe 2.0 x1, USB 2.0) Default for 1 x 802.11 a/b/g/n/ac & BT 5.0 (2T2R)
M.2 B key: 1 x 3042/3052 for 4G/5G/SSD (PCIe 3.0 x1, USB 3.0, USB 2.0, SIM)
Display: 1 x HDMI Supports up to 4096 x 2160 @ 60 Hz, 1 x LVDS Supports up to 1920 x 1080 @ 60 Hz (Dual-link), 1 x eDP Supports up to 2560 x 1600 @ 60 Hz
Audio Out: 1 x 3.5 Phone Jack with Mic-in, 1 x 4 pin stereo, 4ohm, 2 x 3W
USB: 1 x USB 3.2 Gen1 Type C® OTG 2 x USB 3.2 Gen1 Type A Type A 1 x 9 pin USB 2.0 header (2 ports)
Serial Interface: 1 x 3 Pin CAN Bus 2.0B, 2 x 5-Pin COM RS232, 1 x 5 Pin COM RS232/422/485
Maskrom (SPI Flash): 1 x 2-pin header
Power Input (12 ~ 24V): 1 x DC Barrel Power Input Jack (5.5/2.5 mm), 1 x 4-pin Power In Header
Temperature: -0 ~ 60°C
Dimensions: 4" x 4" (100 × 100 mm)
*Default for 1 x 802.11 a/b/g/n/ac wireless & BT 5.0 (2T2R)
Download the Tinker Board 3N datasheet to see the distinctions among the various 3N versions.
