Product specifications
HS24 - SMT Heatsink
Type ............................................ Top Mount
Package Cooled ............................... SMD
Attachment Method .......................... SMD Pad
Shape .......................................... Rectangular
Length ......................................... 0.500" (12.70mm)
Width .......................................... 1.220" (30.99mm)
Diameter ....................................... -
Height Off Base (Height of Fin) ............. 0.400" (10.16mm)
Power Dissipation @ Temperature Rise ... -
Thermal Resistance @ Forced Air Flow .... 16.0°C/W @ 600 LFM
Thermal Resistance @ Natural .............. 50°C/W
Material ......................................... Copper
Material Finish ................................. Solderable
- APEX Microtechnology product -
