September 21, 2020
High Density Power Amplifier ICs Deliver New Levels of High Voltage, High Output Current Performance for a Monolithic Form Factor
New ICs arerated at 220V, 4A and 10A PEAK, offered in a QFPstyle package With a compact 20mm x 20mm package footprint and heat slug topper
The PA164, PA165 are high density, multi-purpose power amplifier ICs that utilize a proprietary monolithic MOSFET technology and silicon design to deliver new benchmarks in performance and thermal management for single-chip power amplifiers. With a footprint measuring just 22mm x 22mm, these devices are capable of providing 1A (PA164) and 4A (PA165) output current continu-ously, and up to 4A (PA164) and 10A (PA165) PEAK on voltage supplies up to 200V, while dissipating up to 28W of internally generated power.The PA164/PA165 uses separate supplies for the amplifier core and the output stage to help optimize overall power dissipation capabilities.
Thermal efficiency is further enhanced by the QFP style package that features a heat slug on top, allowing for the mounting of a single heatsink over a single IC or an “array” pattern of these devices. Onboard protection for these devices includes a user-defined, temperature compensated current limit and a temperature sensor output. The addition of an output disable function and an over cur-rent flag simplify the implementation of robust failure protections on the system level.
Typical Applications
Designers can maximize the real estate saving size advantage offered by the PA164/PA165 by using multiple devices in circuit designs with high power requirements. A wide range of target applica-tions include adjustable voltage and current sources, test equipment, piezo electric positioning, electrostatic transducers, electrostatic deflection, and focusing for deformable mirrors.
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