- Wi-Fi 4 single-band and BLE 5.2 module
- LGA form factor
- FGM842D: 12.5mm × 13.2mm × 1.8mm
- FGM842D-P: 16.6mm × 13.2mm × 1.8mm
- FGM842D: 1.05g
- FGM842D-P: 1.14g
- Operating temperature range: -40℃ to +105℃
- Storage temperature range: -45℃ to +115℃
March 25, 2025
The FGM842D and FGM842D-P Wi-Fi 4 and Bluetooth Low Energy (BLE) 5.2 modules feature high performance ARM968 processors with built-in 288KB RAM and 2MB flash memory to ensure efficient performance.
The modules support UART and GPIO interfaces and offer support for SPI, I2C, ADC and PWM functions in the QuecOpen solution, which offers various low power consumption modes and a keep-alive mechanism to deliver maximum flexibility to designers and developers.
Ideal for smart homes and industrial IoT deployments, the modules comply with the WPA-PSK, WPA2-PSK and WPA3-SAE security standards and support True Random Number Generator (TRNG) and the AES-128 encryption algorithm. In addition, the modules feature secure firmware and flash encryption.
Broadening their appeal further, the modules have a compact LGA package, measuring 12.5mm x 13.2mm x 1.8mm for the Quectel FGM842D and 16.6mm x 13.2mm x 1.8mm for the FGM842D-P. The FGM842D-P features a PCB antenna rather than the FGM842D’s RF coaxial connector or pin antenna interface. Operating in the 2.4GHz Wi-Fi frequency band, the modules operate in temperatures ranging from -40°C to +10 °C.
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