Product specifications
Attend 115A-BDA0-R01
SIM Card Socket Push-Push Type 8+2 Pin
MATERIAL
Housing: LCP+ 30％G.F., UL94V-0 rated, color: black
Contacts: copper alloy
Shield cover: SUS304, 0.2T.
PLATING
Contact area: gold plating over 1.27μm (30 μ") min., nickel underplating
Soldering zone: 3.05μm (120 μ") min. 100% tin, or lead-free plating
per part number designation, over nickel underplating
Shield cover: gold flash nickel underplatlng
Underplating: 1.27μm (30 μ") min. nickel allover.
Cutting burr allowed: 0.03mm max.
Coplanarity is 0.10mm max.
RoHS compliant products
- Attend Technology product -
