Product specifications
Attend 209E-BE01
USB 3.0 Micro B Receptacle, SMD Type (shell T/H)
MATERIAL
Insulator: Thermoplastic, Rated UL94V-0
Contacts: Copper Alloy
Shell: Stainless Steel
CONTACT PLATING
Underplate: 50u”~100u” Nickel
Contact Area: 15u” Gold
Solder Tails Area: 100u”~200u” Tin/Lead Free (Matte)
ELECTRICAL
Current Rating:
1.8 Amps (Max.) Shall Be Applied to Vbus Pin And Its Corresponding GND Pin
0.25 Amps (Min.) Shall Be Applied to All Other Contacts
Contact Resistance:
30mΩ (Max.) Initial for Vbus and GND Contacts
50mΩ (Max.) Initial For All Other Contacts
Insulation Resistance: 100M ohms Min. 250VDC
Dielectric Withstanding Voltage: 100VAC/ Minute
Temperature Range: -20°C~+85°C
Mating Cycles: 10,000 Insertions
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